高温锡膏 Sn96.5Ag3.0Cu0.5 3号粉

焊锡膏是规划用于当今SMT出产工艺的一种免清洗型焊锡膏。选用氧化量很少的无铅合金与无活性较好的助焊膏制作而成，粘度可满意印刷与点涂工艺，运用规模非常广泛。
★习惯各种电子线路板装联职业的各种不同工艺的无铅焊接。

★习惯各种元器件的无铅浸锡或焊接。
★一起还适用多种特殊工艺的焊接。
★一起还能够依据客户的实践出产状况分配契合客户出产的无铅焊锡膏。

长处：
★选用了专用的助焊膏配方其残留物很少，且色泽淡。
★其焊接性极强，能在各种镀层的被焊面无缺焊接。
★可选择多种包装方法：针铜式和罐装。
★可针对特别的焊接工艺调整助焊膏。
产品合金成份及物理特性

现在无铅焊料主要有SnCu、SnAg、SnAgCu、SnCuNi、SnBi等合金成份装备而成。

包装:塑胶瓶包装,0.5公斤/瓶。

1.质量好，潮湿性极佳。

2.有广泛的运用领域，能够专门制作手机，笔记本电脑，数码相机等高端杂乱电子产品制作。

3.焊接性极强，能在各种镀层的被焊面无缺焊接。

4.潮湿性极好，对不易上锡产品板材均有极佳的上锡作用。

5.能够用于精细产品制作，如:连接器，QFN,QFP等高精细产品制作。

功能：

1.印刷翻滚性及落锡性好，对低至0.3mm距离焊盘也能完结精巧的印刷（T6）；

2.接连印刷时，其粘性改变很少，钢网上的可操作寿命长，超越12小时仍不会变干，仍坚持杰出的印刷作用；                        

3.印刷后数小时仍坚持本来的形状，基本无塌落，贴片元件不会发生偏移移；

4.具有极佳的焊接功能，可在不同部位体现出恰当的潮湿性；

5.可习惯不同层次焊接设备的要求，无需在充氮环境下完结焊接，在较宽的回流焊炉温规模内仍可体现杰出的焊接功能。用“升温---保温式”或“逐渐升温式”两类炉温设定方法均可运用；

6.焊接后残留物很少，色彩很浅且具有较大的绝缘阻抗，不会腐蚀PCB，可到达免洗的要求；

7.具有较佳的ICT测验功能，不会发生误判；

8.有针对BGA产品而规划的配方，可解决焊接BGA方面的难题。

Solder paste:

solder paste is a design for today's SMT production process no-clean solder paste. Minimal amount of oxidation using lead-free alloys and inactive better help paste formulated, viscosity can meet the printing and dispensing technology, wide range of applicati***.

★adapt to a variety of electronic circuit boards installed linking the various sectors of lead-free soldering processes.

★adapt to a variety of lead-free solder dip tin or components.

★but also for a variety of special process of welding.

★It also can be deployed to meet customer production of lead-free solder according to the customer's actual production.

Benefits:

★Using a dedicated help paste formulation which very little residue, and the light color.

★weldability strong, good welding can be welded in a variety of coating surface.

★choose a variety of packaging: copper needle type and canned.

★can adjust for special welding flux paste.

Product alloy composition and physical properties

Currently there are lead-free solder SnCu, SnAg, SnAgCu, SnCuNi, SnBi other alloying ingredients dispositi***.

Model SAC305 SBi58 SAC305 SBi58 SAC305 SBi58

Alloy composition SnAg3Cu0.5 SnBi58 SnAg3Cu0.5 SnBi58 SnAg3Cu0.5 SnBi58

A melting point of 217℃138℃217℃138℃217℃138℃

Tin powder particle size 20-45um 20-45um 20-63um 20-63um 20-63um 20-63um

Metal content 89% 89% 89% 89% 89% 89%

Viscosity (Pa_S) 180-220 180-220 160-200 160-200 160-200 160-200

General purpose SMT SMT plug Universal LNB LNB plug radiators for radiators for

Packaging: plastic bottles, 0.5 kg / bottle.

1. Good quality, excellent wettability.

2. There is a wide range of application areas, we can specialize in manufacturing mobile phones, laptop computers, digital cameras and other high-end electronics manufacturing complex.

3. weldability strong, good welding can be welded in a variety of coating surface.

The excellent wettability for easy on tin plate products have excellent effect on the tin.

5. Can be used in precision manufacturing, such as: connectors, QFN, QFP high-precision manufacturing.

Performance:

1. Printing rolling off the tin and good, up to 0.3mm pitch pads can also complete the fine print (T6);

2. Wh